Double-Sided Boards

A double-sided PCB is a type of normal printing circuit board that has conductive layers on both sides. This means that both the top and bottom surfaces of the double-sided board can be used for the connection and installation of electronic components. It consists of a layer of substrate (usually using glass cloth) and two layers of copper foil, with the copper foil patterns etched out to form conductors, pads, and other necessary circuits.

On a double-sided PCB, the connection between the top and bottom layers is achieved through via holes (small holes that connect the two copper layers) and plated-through holes (by adding copper plating conductive in the via holes). This allows for more complex circuit layouts and connections on a double-sided board, providing greater design flexibility.

Double-sided panels are commonly used in moderately designed electronic products, such as consumer electronics, power supply, and industrial control systems. Compared to multilayer boards, these panels offer higher circuit density and better signal integrity at a relatively lower cost.

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Multilayer PCB

It is a type of normal printing circuit board composed of three or more layers, each with a conductive layer in the middle, using electrolytic copper foil or film layers to provide conductivity.

The structure of multilayer boards typically includes inner layers, outer layers, and interlayer connections. The inner layers are conductive layers located inside the board, made of copper foil or film materials. The outer layers are conductive layers located on the surface of the board, also made of copper foil or film materials. Interlayer connections are made through via holes (small holes that connect different layers), with copper plating conductive added to the via holes to achieve circuit connections.

Multilayer boards provide higher circuit density and better signal integrity compared to single-sided and double-sided boards. They are commonly used in highly complex electronic products such as computers, communication network, medical equipment, and industrial control systems. Multilayer boards also offer better electromagnetic compatibility (EMC) and thermal performance, and can reduce the complexity of circuit routing.

Manufacturing multilayer boards requires more process steps and technology, making them more expensive to produce compared to single-sided and double-sided boards. However, due to their design and performance advantages, multilayer boards are widely used in modern electronic design.

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Heavy Copper PCBs

A type of printing circuit board with a thicker copper foil than traditional PCBs. Typically, a standard PCB's copper foil layer thickness ranges from 1 oz to 3 oz, while the copper foil thickness of heavy copper PCBs usually exceeds 3 oz.

Heavy copper PCBs are typically used in application that demand high current conductivity, good thermal performance, and mechanical strength. They are widely used in power supplies, industrial control systems, automotive electronics and solar systems. However, due to their special manufacturing process and higher costs, heavy copper PCBs may require longer production cycles and higher costs compared to standard PCBs.

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High-Frequency Circuit Boards (RF – Radio Frequency)

A type of printing circuit board designed for wireless communication and high-frequency applications. High-frequency circuit boards are typically used to handle and transmit RF signals, characterized by excellent high-frequency performance and signal integrity.

RF circuit boards are widely used in high-frequency applications such as wireless communication systems, satellite communications, radar systems, and wireless sensor networks. They are used to transmit and process RF signals, ensuring high-quality and stable signals for reliable wireless communication and high-frequency applications.

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Semi-Flex PCB

A Semi-Flex PCB is a particular type of printing circuit board that combines the characteristics of both flexible and rigid boards. It has bending capabilities that lie between those of rigid and fully flexible boards.

Semi-Flex PCBs are commonly used in scenarios that require a combination of rigidity and flexibility, such as automotive electronics, medical devices, and aerospace applications. They offer flexible design options while maintaining a certain degree of structural stability. However, due to the complexity of their design and manufacturing, specialized processes and technologies are required to ensure the reliability and performance of the product.

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HDI（High-Density Interconnect）

HDI is a high-density interconnect technology used to manufacture printing circuit boards. HDI technology aims to achieve higher circuit density and more complex electronic component connections to meet the demands of modern electronic products, which are becoming smaller in size and higher in functionality. HDI PCBs feature multiple levels of interconnections, including inner layer connections, through-holes, and microvias.

Anylayer is an advanced HDI technology that allows for a greater number of layers and higher circuit density on a printing circuit board. Anylayer typically uses smaller through-holes and microvias to achieve more complex electronic component connections.

HDI technology is widely used in many applications, especially in smartphones, tablets, digital cameras, and other small portable devices. It provides smaller, lighter, and higher-performance solutions while offering greater flexibility and feasibility for complex electronic designs.

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Insulated Metal Substrate (IMS)

IMS (Insulated Metal Substrate) is a type of insulated metal substrate technology commonly used in high-power electronic devices and thermal management applications. IMS substrates combine the characteristics of metal substrates and insulation layers, providing excellent thermal performance and circuit isolation.

IMS substrates are widely used in various fields, including lighting, automotive electronics, industrial electronics, communications, and energy, to provide thermal solutions and circuit isolation for high-power applications.

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